WLCSP Industrial Park, Suzhou Groundbreaking Ceremony
China Wafer Level CSP Co., Ltd. (WLCSP), a global leading supplier of 3DIC and TSV wafer-level chip size packaging and testing services, held the groundbreaking ceremony to begin the construction of its new industrial park in SIP, Jiangsu Province, China, in the presence of SHEN Mi, Party Secretary of SIP; Wang Wei, Chairman and President of WLCSP; and Daniel Heusser, General Manager of VIRTUARCH on September 21, 2022.
WLCSP Industrial Park will be undertaking technology research and development, expanding the product application market, and establishing an ecological chain of semiconductor industry technology. Virtuarch is honored to have been chosen by the owners not only to design the WLCSP Industrial Park, but also to serve as the project management company for this project.
WLCSP sought an advanced concept for an industrial park, a contemporary, productive, and state-of-the-art layout. Therefore, in the design of VIRTUARCH, while ensuring integrity and independence, it is also open and inclusive enough to be easily shared with the existing factory. VIRTUARCH’s design team proposed clear zoning in the park, with one R&D complex building, five multi-story production plants, two multi-story office buildings, and comprehensive supporting service facilities such as a multi-story parking building and a social building hosting the canteen and a full-size gym.
The R&D building and the multi-story parking building are located along the external road on the park’s south side. Multi-story production buildings dominate the center of the plot. The planning function of zoning is clear when combined with the supporting facilities, landscape, and reserved land.
In this case, through the rotation of the workshop building, the central axis is wholly connected with the main entrance, and the R&D complex building, parking building, plants, and canteen form a pedestrian area with a nice landscape design in the center of the park. Virtuarch designed a representative main gate and a central axis, opening up the main entrance space, increasing public openness in the park, and displaying and projecting the quality of the companies to be hosted in this park outward. The main axis is slightly tilted, giving the whole project a dynamic touch and projecting its energy.
The building’s overall style is contemporary and reduced. The high-rise office building along the street will be built with a full glass curtain wall. The facade of the open parking building is made of metal net with climbing plants providing shading and natural cooling. The facades of the factories, canteens, and small office buildings are uniformly dominated by metal panels. The building bases are connected, which makes the relationship between buildings closer.
As an essential supporting service building for the Industrial Park and the neighboring factory, a generous social building with ample leisure space in the front serves the people of the park, providing convenient conditions and an environment for the employees to enjoy their lunch breaks and do sports.
Project Name: WLCSP Industrial Park, Suzhou |
Plot Area: Suzhou, Jiangsu, P.R.China |
GFA: 120,000 m2 |
Project Timeline: 2022-2023 |
Service: Architectural Concept Design and Project Management |
